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NanoOPS to be Showcased at TechConnect World Innovation Summit & Expo, June 15-17

March 24, 2015

The Nanoscale Offset Printing System (NanoOPS) technology developed by the NSF Center for High-rate Nanomanufacturing at Northeastern will be showcased at this year’s TechConnect World Innovation Summit & Expo, June 15-17, just outside Washington, DC. The TechConnect World Innovation Conference is an annual event uniquely designed to accelerate the commercialization of innovations out of the lab and into industry. Visit TechConnect for more information.